| PART |
Description |
Maker |
| NHD-C12864HZ-FN-FBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C12832A1Z-FS-FBW-3V |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| NHD-C12864WC-FSW-FBW-3V3 |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| THM402020SG-10 THM402020SG-80 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
2,097,152 WORDSx40 BIT DYNAMIC RAM MODULE
2/097/152 WORDSx40 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| THM401020SG-80 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 1,048,576 WORDSx40位动态RAM模块
1,048,576 WORDSx40 BIT DYNAMIC RAM MODULE
1/048/576 WORDSx40 BIT DYNAMIC RAM MODULE
|
Toshiba, Corp.
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| LE-RTDUWS-2W |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
| SIGC25T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip short circuit prove
|
Infineon Technologies AG
|
| SIGC156T60SNR2C |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
| HRC9-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| BC75-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
